The semiconductor company TexasInstruments had also invented integrated circuits, but Fairchildoffered the first commercial integrated circuit in 1961. The developmentof integrated circuits marked a key point in the evolution ofsemiconductor electronics, leaving the limitations of bulky vacuumtube technology in the dust.
by ELIZABETH K. WILSON, C&EN WEST COAST NEWS BUREAU | September 13, 2004
Omenetto, a biomedical engineer at Tufts University, Rogers and coworkers exploit this dissolvability by using thin silicon layers to design resorbable integrated circuits on silk substrates. They constructed the devices using silicon nanomembranes for semiconductors, magnesium for conductors, and magnesium oxide or silicon dioxide for dielectrics.
by Celia Henry Arnaud | September 28, 2012
Fabrication of integrated circuits relies on hundreds of steps involving photolithography on a high-purity silicon wafer to define the shape and pattern of circuit features. Many circuits are made on a single wafer, which is dice to separate the individual rectangular circuits that are then encased in a protective plastic cover with external leads--the familiar computer chip.
by STEPHEN K. RITTER | December 23, 2002
In 1968, Moore and coworker Robert Noyce founded Intel to make complex integrated circuits. Moore's background in chemistry helped him put the "silicon" in "Silicon Valley." In his acceptance speech, he described the basis of Shockley's transistor: Impurities in silicon crystals create a polarity that moves electrons from one area and type of impurity to another.
by MELODY VOITH & MARC REISCH | May 14, 2001
Band gaps are a defining feature of semiconductors and a required property of materials from which digital circuits are fashioned. For that reason, Han Wang, Tomás Palacios, and coworkers at Massachusetts Institute of Technology are turning to materials such as MoS2 to make ultrathin digital circuits.
by Mitch Jacoby | October 08, 2012
DuPont Electronics Technologies introduced CuSolve, aqueous formulations for removing post-etch residue from integrated circuits that feature copper circuit lines and low-k dielectrics. Rohm and Haas and Dow Corning renewed their joint agreement to develop spin-on silicon hard-mask antireflective coating products for semiconductor fabrication.
July 17, 2006
The facility, which will be open to industrial and government participants, will support the emerging field of silicon millimeter- and sub-millimeter-wave integrated circuits. These new circuits will lead, for example, to devices for weapons scanning and air-quality monitoring, the partners say. Meanwhile, Bruker has acquired the assets of AIXUV, an Aachen, Germany-based firm that brings measurement technology in the extreme-ultraviolet spectral range.
by Marc S. Reisch | March 29, 2010